4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Trung T. Doan

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Aluminum alloy containing copper, silicon and titanium for VLSI

Alloys or metallic compositions – Aluminum base – Copper containing
Patent

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Apparatus for endpoint detection during mechanical planarization

Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof
Patent

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Apparatus for planarizing semiconductor wafers, and a polishing

Abrading – Machine – Rotary tool
Patent

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Apparatus for use in semiconductor wafer processing for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Apparatus having titanium silicide and titanium formed by...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-48717

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