Apparatus for planarizing semiconductor wafers, and a polishing

Details Apparatus for planarizing semiconductor wafers, and a polishing Apparatus for planarizing semiconductor wafers, and a polishing

1993-04-08

1995-06-06

Rose, Robert A.

Abrading

Machine

Rotary tool

451285, 451 41, 451288, 451526, B24B 722

Patent

active

054217695

ABSTRACT:
An apparatus for planarizing semiconductor wafers in its preferred form includes a rotatable platen for polishing a surface of the semiconductor wafer and a motor for rotating the platen. A non-circular pad is mounted atop the platen to engage and polish the surface of the semiconductor wafer. A polishing head holds the surface of the semiconductor wafer in juxtaposition relative to the non-circular pad. A polishing head displacement mechanism moves the polishing head and semiconductor wafer across and past a peripheral edge of the non-circular pad to effectuate a uniform polish of the semiconductor wafer surface. Also disclosed is a method for planarizing a semiconductor surface using a non-circular polishing pad.

REFERENCES:
patent: 2597182 (1952-05-01), Rickner et al.
patent: 3186135 (1965-06-01), Crean
patent: 3841031 (1974-10-01), Walsh
patent: 4193226 (1980-03-01), Gill, Jr. et al.
patent: 4239567 (1980-12-01), Winings
patent: 4437269 (1984-03-01), Shaw
patent: 4511605 (1985-04-01), McCartney
patent: 4811522 (1989-03-01), Gill, Jr.
patent: 4927432 (1990-05-01), Budinger et al.
patent: 4934102 (1990-01-01), Leach et al.
patent: 5020283 (1991-06-01), Tuttle
patent: 5036015 (1991-07-01), Shandu et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5104828 (1992-04-01), Murimoto et al.
patent: 5177908 (1993-01-01), Tuttle

Affiliated with

Also associated with

Rating

Apparatus for planarizing semiconductor wafers, and a polishing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for planarizing semiconductor wafers, and a polishing , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for planarizing semiconductor wafers, and a polishing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-983284