Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof
Patent
1991-04-17
1991-12-03
Parker, Roscoe V.
Abrasive tool making process, material, or composition
With carbohydrate or reaction product thereof
51283R, 156626, 156645, 437225, B24B 4916, H01L 21304
Patent
active
050690027
ABSTRACT:
An apparatus for detecting a planar endpoint on a semiconductor wafer during mechanical planarization of the wafer. The planar endpoint is detected by sensing a change in friction between the wafer and a polishing surface. This change of friction may be produced when, for instance, an oxide coating of the wafer is removed and a harder material is contacted by the polishing surface. In a preferred form, the change in friction is detected by rotating the wafer and polishing surface with electric motors and measuring current changes on one or both of the motors. This current change can then be used to produce a signal to operate control means for adjusting or stopping the process.
REFERENCES:
patent: 3699722 (1972-10-01), Davidson et al.
patent: 3841031 (1974-10-01), Walsh
patent: 3979239 (1976-09-01), Walsh
patent: 4193226 (1980-03-01), Gill et al.
patent: 4358338 (1982-11-01), Downey et al.
patent: 4407094 (1983-10-01), Bennett
patent: 4663890 (1987-05-01), Brandt
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4811522 (1989-03-01), Gill et al.
patent: 4879258 (1989-11-01), Fisher
patent: 4910155 (1990-03-01), Cote et al.
patent: 4914868 (1990-04-01), Church et al.
patent: 4956313 (1990-09-01), Cote et al.
Doan Trung T.
Sandhu Gurtej S.
Schultz Laurence D.
Crowder Albert M.
Micro)n Technology, Inc.
Parker Roscoe V.
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