Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
Inventor
active
Die level metal density gradient for improved flip chip...
Dynamic pad size to reduce solder fatigue
Metal reduction in wafer scribe area
Scribe street structure for backend interconnect...
No associations
LandOfFree
Trent S. Uehling does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Trent S. Uehling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Trent S. Uehling will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2287157