4. Refrigeration
  5. Automatic control
  6. Preventing, removing or handling atmospheric condensate

Toshiyuki Fukuda

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Bonded structure and bonding method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Connection structure and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Imaging module and method for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
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Lead frame and method of producing the same, and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Lead frame and method of producing the same, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-5240

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