4. Metal treatment
  5. Stock
  6. Ferrous

Toshitada Netsu

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Device for sealing and cooling multi-chip modules

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Device for sealing and cooling multi-chip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Electronic circuit apparatus comprising a structure for sealing

Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent

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Electronic circuit device, method of connecting with solder and

Metal treatment – Stock – Ferrous
Patent

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Structure for mounting a semiconductor device and a...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-990160

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