Electronic circuit apparatus comprising a structure for sealing

Details Electronic circuit apparatus comprising a structure for sealing Electronic circuit apparatus comprising a structure for sealing

1991-03-28

1992-09-29

Jackson, Jr., Jerome

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 80, 174 5052, H01L 2302, H01L 2312, H01L 3902

Patent

active

051517736

ABSTRACT:
An electronic circuit apparatus in which electronic circuit components are mounted to multiwiring substrate or the like for use with electronic circuits such as an LSI are sealed airtight by sealing units. The sealing unit is sealed by an upper board designated as an upper board sealing unit and a side board designated as a side board sealing unit, and the shape of the edge on cross section of the side board is convex or circular. Metallization is applied to solder joint portions between a substrate and a side board and between the side board and the upper board, and a predetermined solder joint height is provided by a support post to effect solder joining.

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