4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Tom Molinaro

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Ball bumping substrates, particuarly wafers

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Forming solder balls on substrates

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Reexamination Certificate

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Forming solder balls on substrates

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Forming solder balls on substrates

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Forming solder balls on substrates

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2078798

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