Forming solder balls on substrates

Details Forming solder balls on substrates Forming solder balls on substrates

2008-11-26

2010-02-02

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

C228S041000, C228S044700, C228S049500, C269S021000

Reexamination Certificate

active

07654432

ABSTRACT:
A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

REFERENCES:
patent: 3458925 (1969-08-01), Napier et al.
patent: 3520055 (1970-07-01), Jannett
patent: 3569607 (1971-03-01), Martyak et al.
patent: 3617045 (1971-11-01), DaCosta et al
patent: 3719981 (1973-03-01), Steitz
patent: 4412642 (1983-11-01), Fisher, Jr.
patent: 4523712 (1985-06-01), Zado
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4622239 (1986-11-01), Schoenthaler et al.
patent: 4655164 (1987-04-01), Nelson et al.
patent: 4763829 (1988-08-01), Sherry
patent: 4856185 (1989-08-01), Baumgartner
patent: 4893403 (1990-01-01), Heflinger et al.
patent: 4898320 (1990-02-01), Dunaway et al.
patent: 4906823 (1990-03-01), Kushima et al.
patent: 4914814 (1990-04-01), Behun et al.
patent: 4950623 (1990-08-01), Dishon
patent: 4953460 (1990-09-01), Wojcik
patent: 5001829 (1991-03-01), Shelhorn
patent: 5014162 (1991-05-01), Clark et al.
patent: 5024372 (1991-06-01), Altman et al.
patent: 5039628 (1991-08-01), Carey
patent: 5046161 (1991-09-01), Takada
patent: 5079835 (1992-01-01), Lam
patent: 5108027 (1992-04-01), Warner et al.
patent: 5118027 (1992-06-01), Braun et al.
patent: 5118029 (1992-06-01), Fuse et al.
patent: 5137845 (1992-08-01), Lochon et al.
patent: 5141212 (1992-08-01), Beeding
patent: 5172469 (1992-12-01), Onda et al.
patent: 5197655 (1993-03-01), Leerssen et al.
patent: 5206585 (1993-04-01), Chang et al.
patent: 5211328 (1993-05-01), Ameen et al.
patent: 5268068 (1993-12-01), Cowell et al.
patent: 5307983 (1994-05-01), Dudderar et al.
patent: 5310574 (1994-05-01), Holtmann
patent: 5346118 (1994-09-01), Degani et al.
patent: 5366760 (1994-11-01), Fujii et al.
patent: 5372295 (1994-12-01), Abe et al.
patent: 5381848 (1995-01-01), Trabucco
patent: 5388327 (1995-02-01), Trabucco
patent: 5395040 (1995-03-01), Holzmann
patent: 5438020 (1995-08-01), Grancher et al.
patent: 5439164 (1995-08-01), Hasegawa et al.
patent: 5449108 (1995-09-01), Park
patent: 5460316 (1995-10-01), Hefele
patent: 5480835 (1996-01-01), Carney et al.
patent: 5492266 (1996-02-01), Hoebner et al.
patent: 5535936 (1996-07-01), Chong et al.
patent: 5536677 (1996-07-01), Hubacher
patent: 5539153 (1996-07-01), Schwiebert et al.
patent: 5632434 (1997-05-01), Evans et al.
patent: 5658827 (1997-08-01), Aulicino et al.
patent: 5667128 (1997-09-01), Rohde et al.
patent: 5759269 (1998-06-01), Cutting et al.
patent: 5773897 (1998-06-01), Wen et al.
patent: 5782399 (1998-07-01), Lapastora
patent: 5804017 (1998-09-01), Hector
patent: 5806753 (1998-09-01), Bielick et al.
patent: 5829668 (1998-11-01), George et al.
patent: 5842626 (1998-12-01), Bhansali et al.
patent: 5877079 (1999-03-01), Karasawa et al.
patent: 5934545 (1999-08-01), Gordon
patent: 5950908 (1999-09-01), Fujino et al.
patent: 5988487 (1999-11-01), Mackay et al.
patent: 6008071 (1999-12-01), Karasawa et al.
patent: 6051273 (2000-04-01), Dalal et al.
patent: 6109175 (2000-08-01), Kinoshita
patent: 6126059 (2000-10-01), Mackay et al.
patent: 6153505 (2000-11-01), Bolde et al.
patent: 6271503 (2001-08-01), Hall et al.
patent: 6293456 (2001-09-01), Mackay et al.
patent: 7007833 (2006-03-01), Mackay et al.
patent: 2005/0150936 (2005-07-01), Mackay et al.
patent: 2006/0035454 (2006-02-01), Belanger et al.
1995 Ball Grid Array Technology, Lau. McGraw-Hill, 1995 ISBN: 007036608X.

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