Forming solder balls on substrates

Details Forming solder balls on substrates Forming solder balls on substrates

2006-03-07

2006-03-07

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Including means to force or clamp work portions together...

Work portion comprises electrical component

C228S049500, C269S021000

Reexamination Certificate

active

07007833

ABSTRACT:
A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

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