Forming solder balls on substrates

Details Forming solder balls on substrates Forming solder balls on substrates

2006-03-07

2009-10-20

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Preplacing solid filler

C438S613000

Reexamination Certificate

active

07604153

ABSTRACT:
A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

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Ball Grid Array Technology, Lau. McGraw-Hill, 1995 ISBN: 007036608X.

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