Forming solder balls on substrates

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S041000, C228S044700, C228S049500, C269S021000

Reexamination Certificate

active

07837083

ABSTRACT:
A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

REFERENCES:
patent: 3617045 (1971-11-01), Da Costa et al.
patent: 5001829 (1991-03-01), Schelhorn
patent: 5014162 (1991-05-01), Clark et al.
patent: 5079835 (1992-01-01), Lam
patent: 5172469 (1992-12-01), Onda et al.
patent: 5197655 (1993-03-01), Leerssen et al.
patent: 5310574 (1994-05-01), Holtmann
patent: 5346118 (1994-09-01), Degani et al.
patent: 5366760 (1994-11-01), Fujii et al.
patent: 5439164 (1995-08-01), Hasegawa et al.
patent: 5460316 (1995-10-01), Hefele
patent: 5492266 (1996-02-01), Hoebener et al.
patent: 5539153 (1996-07-01), Schwiebert et al.
patent: 5632434 (1997-05-01), Evans et al.
patent: 5658827 (1997-08-01), Aulicino et al.
patent: 5667128 (1997-09-01), Rohde et al.
patent: 5759269 (1998-06-01), Cutting et al.
patent: 5773897 (1998-06-01), Wen et al.
patent: 5782399 (1998-07-01), Lapastora
patent: 5804017 (1998-09-01), Hector
patent: 5806753 (1998-09-01), Bielick et al.
patent: 5829668 (1998-11-01), George et al.
patent: 5842626 (1998-12-01), Bhansali et al.
patent: 5877079 (1999-03-01), Karasawa et al.
patent: 5934545 (1999-08-01), Gordon
patent: 5950908 (1999-09-01), Fujino et al.
patent: 6008071 (1999-12-01), Karasawa et al.
patent: 6051273 (2000-04-01), Dalal et al.
patent: 6109175 (2000-08-01), Kinoshita
patent: 6126059 (2000-10-01), MacKay et al.
patent: 6153505 (2000-11-01), Bolde et al.
patent: 6609652 (2003-08-01), MacKay et al.
patent: 7007833 (2006-03-01), Mackay et al.
patent: 7654432 (2010-02-01), MacKay et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Forming solder balls on substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Forming solder balls on substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Forming solder balls on substrates will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4193457

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.