Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
Inventor
active
Contact sidewall tapering with argon sputtering
Dry etch endpoint method
Equipment and method for applying a liquid layer
Peeling free metal silicide films using ion implantation
Peeling free metal silicide films using rapid thermal anneal
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Profile ID: LFUS-PAI-P-281059