Equipment and method for applying a liquid layer

Details Equipment and method for applying a liquid layer Equipment and method for applying a liquid layer

1995-01-19

1997-07-08

Bell, Janyce

Fishing, trapping, and vermin destroying

427 96, 427240, 4273855, 437231, 437235, 437245, H01L 21465, B05D 312

Patent

active

056460716

ABSTRACT:
A method and apparatus for applying a liquid to the surface of semiconductor wafer are described. The wafer is rotated about an axis; perpendicular to its main surface. Liquid is dispensed onto the surface of the spinning wafer from at least two dispensing bottles. One of the dispensing bottles is positioned above the center of rotation while the others are located between it and the wafer's edge. The rate at which liquid emerges from each of the dispensing bottles is independently controlled for each bottle.

REFERENCES:
patent: 4393807 (1983-07-01), Fujimura et al.
patent: 4550679 (1985-11-01), Pipa et al.
patent: 4668334 (1987-05-01), Doornveld
patent: 5001084 (1991-03-01), Kawai et al.
patent: 5328871 (1994-07-01), Tanigawa et al.

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