4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Tien-I Bao

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Bond pad structure having dummy plugs and/or patterns formed...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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C x H y sacrificial layer for cu/low-k interconnects

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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C x H y sacrificial layer for cu/low-k interconnects

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Composite etching stop in semiconductor process integration

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate

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Composite etching stop in semiconductor process integration

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Profile ID: LFUS-PAI-P-583903

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