Bond pad structure having dummy plugs and/or patterns formed...

Details Bond pad structure having dummy plugs and/or patterns formed... Bond pad structure having dummy plugs and/or patterns formed...

2008-09-19

2011-10-04

Smoot, Stephen W (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S786000, C257SE23020

Reexamination Certificate

active

08030781

ABSTRACT:
A semiconductor structure is provided. In one embodiment, a bond pad is formed above one or more underlying layers of a substrate. A plurality of dummy plugs are spaced around the bond pad, the plurality of dummy plugs substantially vertically traversing the one or more underlying layers, wherein the plurality of dummy plugs anchor at least two of the underlying layers together to achieve improved mechanical strength.

REFERENCES:
patent: 7049701 (2006-05-01), Usui
patent: 7211897 (2007-05-01), Yamanoue et al.

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