4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. For plural devices

Thurston Bryce Youngs, Jr.

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active

Chip stacking by edge metallization

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Floating interposer

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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High density edge mounting of chips

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Method for high density edge mounting of chips

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent

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Method of forming a metallization feature on an edge of an IC ch

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent

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