Method of forming a metallization feature on an edge of an IC ch

Details Method of forming a metallization feature on an edge of an IC ch Method of forming a metallization feature on an edge of an IC ch

1999-10-20

2000-12-05

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

427584, 427576, 427585, 427250, 427435, 438106, 438758, C23C 1434, C23C 1600, C23C 408, B05D 118, H01L 2131

Patent

active

061561657

ABSTRACT:
An integrated circuit package derives increased mechanical robustness and electrical reliability consistent with increased heat dissipation capacity by edge bonding of integrated circuit chips onto a substrate such as a chip, board, module or another integrated circuit by forming a solder or conductive adhesive bond between a bonding/contact pad on the substrate and a metallization feature extending at least on limited opposing areas of major surfaces of the chip and, preferably, across the edge of the chip. Thermally conducting material contained in a cap may provide additional, distributed support for the chip by a combination of viscosity and density providing buoyancy of the chips. Alternatively, a cap may be provided which further stabilizes the edge-mounting of chips while increasing velocity of cooling fluid against the chips. Novel techniques of forming a metallization feature across the edge of a chip with high efficiency and manufacturing yield includes enclosure of chips or strips of chips in a tool including a grooved mask or enclosing the chips or strips of chips in a resist which may be exposed and developed using at least a portion of the same tool.

REFERENCES:
patent: 4266282 (1981-05-01), Henle et al.
patent: 4551629 (1985-11-01), Carson et al.
patent: 4706166 (1987-11-01), Go
patent: 4922378 (1990-05-01), Malhi et al.
patent: 4980002 (1990-12-01), Dzarnoski, Jr. et al.
patent: 4983533 (1991-01-01), Go
patent: 4992908 (1991-02-01), Solomon
patent: 4999311 (1991-03-01), Dzarnoski, Jr. et al.
patent: 5025306 (1991-06-01), Johnson et al.
patent: 5031072 (1991-07-01), Malhi et al.
patent: 5075253 (1991-12-01), Sliwa, Jr.
patent: 5104820 (1992-04-01), Go et al.
patent: 5113315 (1992-05-01), Wheeler et al.
patent: 5146308 (1992-09-01), Chance et al.
patent: 5229916 (1993-07-01), Frankeny et al.
patent: 5239199 (1993-08-01), Chiu
patent: 5266833 (1993-11-01), Capps
patent: 5279991 (1994-01-01), Minahan et al.
patent: 5313096 (1994-05-01), Eide
patent: 5327327 (1994-07-01), Frew et al.
patent: 5347428 (1994-09-01), Carson et al.
patent: 5356838 (1994-10-01), Kim
patent: 5362986 (1994-11-01), Angiulli et al.
patent: 5380681 (1995-01-01), Hsu
patent: 5397747 (1995-03-01), Angiulli et al.
patent: 5424920 (1995-06-01), Miyake
patent: 5426563 (1995-06-01), Moresco et al.
patent: 5426566 (1995-06-01), Beilstein, Jr. et al.
patent: 5455455 (1995-10-01), Badehi
patent: 5455740 (1995-10-01), Burns
patent: 5478781 (1995-12-01), Bertin et al.
patent: 5502667 (1996-03-01), Bertin et al.
patent: 5744016 (1998-04-01), Yamada et al.
patent: 5786632 (1998-07-01), Farnworth et al.
patent: 5818107 (1998-10-01), Pierson et al.
"Edge-Mounted Chip Assembly For Microprocessor"; IBM Technical Disclosure Bulletin, vol. 23, No. 2, Jul. 1980; H.I. Stoller; pp. 581 and 582.

Affiliated with

Also associated with

Rating

Method of forming a metallization feature on an edge of an IC ch does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a metallization feature on an edge of an IC ch, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a metallization feature on an edge of an IC ch will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-957933