4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Combined with the removal of material by nonchemical means

Thomas W. Mountsier

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Boron-doped SIC copper diffusion barrier films

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Chemical vapor deposition system including dedicated...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate

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Diffusion barrier layers

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Reexamination Certificate

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High aspect ratio gapfill process by using HDP

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent

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Low-k B-doped SiC copper diffusion barrier films

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1823739

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