4. Electricity: measuring and testing
  5. Impedance, admittance or other quantities representative of...
  6. Lumped type parameters

Thomas Herbert Shilling

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Device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Integrated circuit and a method of manufacturing an...

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate

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Method of testing an integrated circuit

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters
Reexamination Certificate

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Process for packaging electronic devices using thin bonding...

Etching a substrate: processes – Etching of semiconductor material to produce an article...
Reexamination Certificate

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Semiconductor device package with base features to reduce...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2593043

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