Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With electrical contact in hole in semiconductor
Inventor
active
Direct backside interconnect for multiple chip assemblies
Method of manufacture TiW alignment mark and implant mask
Passivation layer for a circuit device and method of...
Selective backside plating of GaAs monolithic microwave integrat
Selective backside plating of gaas monolithic microwave integrat
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Profile ID: LFUS-PAI-P-78649