Thomas A. Scharr

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Device for solder removal

Metal fusion bonding – Process of disassembling bonded surfaces – per se
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Elevated edge-protected bonding pedestals for semiconductor devi

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Method for forming a flip-chip bond from a gold-tin eutectic

Fishing – trapping – and vermin destroying
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Semiconductor chip with direct-bonded external leadframe

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Profile ID: LFUS-PAI-P-966397

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