Elevated edge-protected bonding pedestals for semiconductor devi

Details Elevated edge-protected bonding pedestals for semiconductor devi Elevated edge-protected bonding pedestals for semiconductor devi

1979-09-19

1983-07-19

James, Andrew J.

357 65, 357 71, H01L 2348, H01L 2944, H01L 2952

Patent

active

043946780

ABSTRACT:
An elevated bonding pad suitable for wire or lead frame attachment and having an insulating layer completely over its outer periphery. The structure simplifies the processing required to form an elevated bonding pad, and serves to protect the periphery against bonding damage, and provides protection against corrosion of the bonded encapsulated semiconductor unit.

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