Method for forming a flip-chip bond from a gold-tin eutectic

Details Method for forming a flip-chip bond from a gold-tin eutectic Method for forming a flip-chip bond from a gold-tin eutectic

1992-09-28

1994-09-13

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437188, 437196, 437209, 22818022, 228254, H01L 21283, H01L 2158, H01L 2160, H01L 21603

Patent

active

053468570

ABSTRACT:
A method for flip-chip bonding an integrated circuit die to a substrate. A substrate (21) having conductive bonding areas (22) coated with tin (23) is secured to a bottom end effector of a flip-chip bonding apparatus. An integrated circuit die (26) having gold bumps (28) is secured to a die tool of the flip-chip bonding apparatus. A gold-tin eutectic bond is formed between the integrated circuit die (26) and the conductive bonding areas (22) of the substrate (21).

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