Patent
1979-09-19
1986-09-02
James, Andrew J.
357 65, 357 70, 357 71, H01L 2348, H01L 2940, H01L 2944
Patent
active
046099360
ABSTRACT:
Structure and process for providing a hard metallic leadframe directly bonded to a semiconductor chip without the necessity for solder or soft intermediate leadframes. The structure provides a strong bond at the semiconductor chip with the possibility for multiple simultaneous lead attachment of a leadframe having sufficient strength to serve as the external leads. The bonded structure may be conventionally encapsulated in a plastic or ceramic package, or may be glassed to provide a minimum volume hermetic chip.
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Scharr Thomas A.
Winchell, II Vern H.
Handy Robert M.
James Andrew J.
Motorola Inc.
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