Metal fusion bonding – Process of disassembling bonded surfaces – per se
Patent
1990-05-03
1991-12-17
Ramsey, Kenneth J.
Metal fusion bonding
Process of disassembling bonded surfaces, per se
228 19, B23K 1018
Patent
active
050728733
ABSTRACT:
A device having a plurality of columnar structures comprised of a solderable metal disposed on a supporting base is used to remove solder from a substrate surface. Capillary action takes place in the area between the columns, thus removing the solder from the substrate surface. The present invention may be fabricated by forming columnar structures on the supporting base through mask openings or by etching a solderable metal layer into columnar structures. A standoff may be built into the device to prevent solder residue from remaining on the substrate surface between solder pads and to allow a controllable amount of solder to be left on the substrate surface.
REFERENCES:
patent: 3387191 (1968-06-01), Fishman et al.
patent: 4067104 (1978-01-01), Tracy
patent: 4090656 (1978-05-01), Sato et al.
patent: 4465223 (1984-08-01), Cammarano et al.
Liu Jay J.
Lytle William H.
Scharr Thomas A.
Barbee Joe E.
Jackson Miriam
Motorola Inc.
Ramsey Kenneth J.
LandOfFree
Device for solder removal does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Device for solder removal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for solder removal will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-831771