4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Thiam Beng Lim

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Highly reliable and planar ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent

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IC packaging lead frame for reducing chip stress and deformation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Lead frame for an integrated circuit chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Lead frame for an integrated circuit chip (integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Low cost and highly reliable chip-sized package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Profile ID: LFUS-PAI-P-400508

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