Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent
1996-10-21
1999-04-06
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
257787, H01L 2348, H01L 2352, H01L 2940
Patent
active
058922903
ABSTRACT:
The invention is directed to a BGA package and method for making a BGA package in which warpage, delamination and package cracking are reduced. The inventive BGA package has a die attached to one surface of a substrate. The substrate may terminate at its opposite surface in an array of connection ports which is an integral part of the substrate. Alternatively, the array of connection ports is attached to the opposite surface of the substrate. The connection ports may be attach pads attached to the opposite surface of the substrate and solder balls or metal bumps attached to the attach pads. A matrix of molding compound fully encapsulates the substrate, die and the array of connection ports. The matrix molding compound is then ground to provide a flat surface and to expose portions of the connection ports. Another array of connection ports, such as an array of solder balls or metal bumps, may be attached to the existing array of connection ports. In another embodiment, retracting pins are positioned over the solder attach pads. The mold compound fully encapsulates the substrate, die, solder attach pads and portions of the retracting pins. Removing the retracting pins, after the encapsulation, exposes portions of the solder attach pads so that solder balls or metal bumps are attached to the exposed portions of the solder attach pads.
REFERENCES:
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5506756 (1996-04-01), Haley
patent: 5612576 (1997-03-01), Wilson et al.
Chakravorty Kishore Kumar
Lim Thiam Beng
Clark S. V.
Institute of Microelectronics
Saadat Mahshid D.
LandOfFree
Highly reliable and planar ball grid array package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Highly reliable and planar ball grid array package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Highly reliable and planar ball grid array package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1374048