4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

Tanya Jegeris Snyder

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Wafer bonding using reactive foils for massively parallel...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Wafer bonding using reactive foils for massively parallel...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Wafer-level packaging of optoelectronic devices

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Wafer-level packaging of optoelectronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2866007

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