Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-03-02
2008-09-09
Nhu, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S022000, C438S051000, C438S064000, C438S025000, C257SE21499, C257SE31117, C257SE31127
Reexamination Certificate
active
07422929
ABSTRACT:
In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket is formed on a second wafer, the second wafer is attached to the first wafer with a bond between the gasket and the bonding pad.
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Fazzio Ronald Shane
Gallup Kendra J.
Geefay Frank S.
Guthrie Carrie Ann
Johnson Martha
Avago Technologies Fiber IP Pte Ltd
Nhu David
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