4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Ball or nail head type contact, lead, or bond

Takasi Togasaki

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Electronic circuit device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Electronic circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent

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Semiconductor device with improved encapsulating resin

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Semiconductor device with improved encapsulating resin

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Semiconductor flipchip packaging having a perimeter wall

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Profile ID: LFUS-PAI-P-524351

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