Semiconductor device with improved encapsulating resin

Details Semiconductor device with improved encapsulating resin Semiconductor device with improved encapsulating resin

1996-01-03

1999-01-26

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257787, 257788, 257738, 257790, H01L 2160, H01L 2328

Patent

active

058641785

ABSTRACT:
A semiconductor device comprising a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board, a space between the circuit board and the semiconductor chip as well as a periphery of the semiconductor chip being encapsulated with a resin containing a filler. The resin is constituted by a first resin disposed in a region surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, and by a second resin disposed in a region not surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, the first and second resins being distinct from each other in at least one feature selected from a content, a maximum particle diameter and an average particle diameter of the filler.

REFERENCES:
patent: 4604644 (1986-08-01), Beckham et al.
patent: 5121190 (1992-06-01), Hsiao et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5385869 (1995-01-01), Liu et al.
patent: 5629566 (1997-05-01), Doi et al.

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