Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-07-29
1997-11-04
Ledynh, Bot L.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361760, 361767, 361768, 361773, 361774, 361808, 174260, 174261, 257737, 257738, 257779, 257780, 257784, 257786, H05K 702, H05K 710, H05K 116
Patent
active
056846770
ABSTRACT:
An electronic circuit device comprising a printed wiring board having a major surface and pads provided on the major surface of the printed wiring board, a plurality of electrodes provided partly on at least one major surface of the leadless component and partly on sides of the leadless component, a plurality of bumps provided on the pads, providing a gap between the major surface of the printed wiring board and the major surface of the leadless component, and electrically connecting those parts of the electrodes which are provided on the major surface of the leadless component to the pads, and a plurality of electrically conductive members integral with the bumps, extending from the bumps to those parts of the electrodes which are provided on the sides of the leadless component.
REFERENCES:
patent: 4641222 (1987-02-01), Derfiny et al.
patent: 4760948 (1988-08-01), Spiecker
patent: 5001829 (1991-03-01), Schelhorn
patent: 5255839 (1993-10-01), Da Costa Alves et al.
patent: 5284796 (1994-02-01), Nakanishi et al.
patent: 5315070 (1994-05-01), Maiwald
Kizaki Yukio
Mori Miki
Saito Masayuki
Togasaki Takasi
Uchida Tatsuro
Kabushiki Kaisha Toshiba
Ledynh Bot L.
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