4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Chip mounted on chip

Takaharu Yamano

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Chip embedded substrate and method of producing the same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Electronic parts packaging structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Laminated semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Manufacturing method for semiconductor device embedded...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Manufacturing method for semiconductor device embedded...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2172586

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