Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2011-08-02
2011-08-02
Semenenko, Yuriy (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S263000, C257S690000, C257S780000
Reexamination Certificate
active
07989707
ABSTRACT:
A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.
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Arai Tadashi
Iida Kiyoaki
Iizuka Hajime
Kobayashi Toshio
Kobayashi Tsuyoshi
Aychillhum Andargie M
Ladas & Parry LLP
Semenenko Yuriy
Shinko Electric Industries Co. Ltd.
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