Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-07-26
2011-07-26
Lee, Cheung (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S026000, C438S063000, C438S125000, C257SE21499, C257SE21505, C257SE21511
Reexamination Certificate
active
07985619
ABSTRACT:
A manufacturing method for a semiconductor device embedded substrate, includes: a first step of preparing a semiconductor device having a first insulating layer; a second step of preparing a support body, and arranging the semiconductor device on one surface of the support body; a third step of forming a second insulating layer on the one surface of the support body; a fourth step of removing the support body; a fifth step of forming a first wiring pattern on a surface of each of the first insulating layer and the second insulating layer; a sixth step of forming a via-hole from which the first wiring pattern is exposed on the second insulating layer; and a seventh step of forming a second wiring pattern electrically connected on a surface of the second insulating layer.
REFERENCES:
patent: 2006/0202353 (2006-09-01), Wakabayashi et al.
patent: 2842378 (1998-10-01), None
patent: 2005-332887 (2005-12-01), None
patent: 4121542 (2008-05-01), None
Arai Tadashi
Kobayashi Toshio
Yamano Takaharu
Drinker Biddle & Reath LLP
Lee Cheung
Shinko Electric Industries Co. Ltd.
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