4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Sunil Thomas

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Backside encapsulation of tape automated bonding device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Backside encapsulation of tape automated bonding device

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Electro-thermal nested die-attach design

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent

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Electro-thermal nested die-attach design

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Flip-chip assembly of protected micromechanical devices

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-106119

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