4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. For plural devices

Sugano Toshio

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Lead connections means for stacked tab packaged IC chips

Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent

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Process for manufacturing a stacked integrated circuit package

Fishing – trapping – and vermin destroying
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Semiconductor device

Patent

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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Semiconductor device having particular mounting arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Profile ID: LFUS-PAI-P-540831

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