Semiconductor device having particular mounting arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

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Details

257724, 257685, 257686, H01L 2312, H01L 2512

Patent

active

052276643

ABSTRACT:
In an SIP type module of the type wherein memory ICs are mounted to both surfaces of a substrate, the present invention provides a face package type memory module wherein packaging is made in an inclined direction in place of vertical packaging of the prior art technique and only the memory ICs mounted to the upper surface side of the substrate are deviated to the positions closer to the end portion of the substrate in order to drastically reduce the packaging height.

REFERENCES:
patent: 4074342 (1978-02-01), Honn et al.
patent: 4616655 (1986-10-01), Weinberg et al.
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 4984064 (1991-01-01), Toshio et al.
patent: 4994896 (1991-02-01), Uemura et al.
patent: 5061990 (1991-10-01), Arakawa et al.
"VLSI Device Handbook", published by K. K. Science Forum, Nov. 28, 1983, pp. 239-250.

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