Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1991-06-05
1993-07-13
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257724, 257685, 257686, H01L 2312, H01L 2512
Patent
active
052276643
ABSTRACT:
In an SIP type module of the type wherein memory ICs are mounted to both surfaces of a substrate, the present invention provides a face package type memory module wherein packaging is made in an inclined direction in place of vertical packaging of the prior art technique and only the memory ICs mounted to the upper surface side of the substrate are deviated to the positions closer to the end portion of the substrate in order to drastically reduce the packaging height.
REFERENCES:
patent: 4074342 (1978-02-01), Honn et al.
patent: 4616655 (1986-10-01), Weinberg et al.
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 4984064 (1991-01-01), Toshio et al.
patent: 4994896 (1991-02-01), Uemura et al.
patent: 5061990 (1991-10-01), Arakawa et al.
"VLSI Device Handbook", published by K. K. Science Forum, Nov. 28, 1983, pp. 239-250.
Seiichirou Tsukui
Shigeru Suzuki
Toshio Sugano
Clark S. V.
Hille Rolf
Hitachi , Ltd.
Hitachi Tobu Semiconductor
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