Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1993-03-02
1995-03-07
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257724, 257777, H01L 2316
Patent
active
053961021
ABSTRACT:
In an SIP type module of the type wherein memory ICs are mounted to both surfaces of a substrate, the present invention provides a face package type memory module wherein packaging is made in an inclined direction in place of vertical packaging of the prior art technique and only the memory ICs mounted to the upper surface side of the substrate are deviated to the positions closer to the end portion of the substrate in order to drastically reduce the packaging height.
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"VLSI Device Handbook", published by K. K. Science Forum, Nov. 28, 1993, pp. 239-250.
Seiichirou Tsukui
Shigeru Suzuki
Toshio Sugano
Clark S. V.
Hitachi , Ltd.
Hitachi Tobu Semiconductor Ltd.
James Andrew J.
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