4. Semiconductor device manufacturing: process
  5. Making field effect device having pair of active regions...
  6. Having schottky gate

Su C. Kim

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Bump structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Chip package structure and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
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Contact process and structure for a semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Double gated transistor and method of fabrication

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
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IC package, inspection method of IC package mounting body,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2357756

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