IC package, inspection method of IC package mounting body,...

Details IC package, inspection method of IC package mounting body,... IC package, inspection method of IC package mounting body,...

2007-03-20

2007-03-20

Kebede, Brook (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C438S004000, C257SE21508

Reexamination Certificate

active

10940963

ABSTRACT:
Disclosed is an IC package including an interpose substrate and lands for external connection disposed on a face of the interpose substrate in a grid pattern, the interpose substrate having a penetration hole on at least a position between the lands for external connection disposed in a grid pattern. Besides, there are disclosed an inspection method of an IC package mounting body mounting this IC package, a repairing method of an IC package mounting body mounting this IC package, and an inspection pin for an IC package mounting body used for such an inspection.

REFERENCES:
patent: 5953592 (1999-09-01), Taniguchi et al.
patent: 6014318 (2000-01-01), Takeda
patent: 6932618 (2005-08-01), Nelson
patent: 2002/0117751 (2002-08-01), Crane et al.
patent: 2003/0214047 (2003-11-01), Noguchi
patent: 2003-338588 (2003-11-01), None

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