4. Semiconductor device manufacturing: process
  5. Semiconductor substrate dicing
  6. Having a perfecting coating

Steven W. Heppler

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Ball grid array interposer, packages and methods

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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IC pin forming machine with integrated IC testing capability

Metal fusion bonding – With means to juxtapose and bond plural workpieces – With means to treat workpieces
Patent

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Interposers with receptacles for receiving semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate

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Moisture-resistant electronic device package and methods of...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Moisture-resistant electronic device package and methods of...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Profile ID: LFUS-PAI-P-467684

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