Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
2005-10-11
2005-10-11
Ngo, Hung V. (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C174S050510, C257S693000, C257S778000
Reexamination Certificate
active
06953891
ABSTRACT:
Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
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Bolken et al. Co-pending U.S. Appl. No. 10/164,077 filed Jun. 4, 2002 entitled “Packages for Image Sensitive Electronic Devices and Methods of Assembly”.
Kinsman, Larry D., Co-pending U.S. Appl. No. 10/228,411 filed Aug. 26, 2002 entitled “Optically Interactive Device Packages and Methods of Assembly”.
Baerlocher Cary J.
Bolken Todd O.
Cobbley Chad A.
Heppler Steven W.
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