IC pin forming machine with integrated IC testing capability

Details IC pin forming machine with integrated IC testing capability IC pin forming machine with integrated IC testing capability

1992-12-11

1993-09-28

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

With means to treat workpieces

228 9, 228 565, 29705, 29827, 156378, B23P 2100

Patent

active

052480755

ABSTRACT:
The present invention relates to integrated circuits (ICs) fabrication and testing. Particularly, there is an IC pin/lead trimming and forming machine that is adapted to electrically test ICs for electrical defects. Uniquely, the IC testing can occur at any pin forming station after the IC pins or leads have been electrically isolated from each other and from other ICs on a lead frame. This arrangement will allow for testing of the individual ICs much sooner than has hereinbefore existed after undertaking the encapsulation process.

REFERENCES:
patent: 3803709 (1974-04-01), Beltz et al.
patent: 4485548 (1984-12-01), Janisiewicz
patent: 4654914 (1987-04-01), Schneider et al.
patent: 4736520 (1988-04-01), Morris
patent: 4924179 (1990-05-01), Sherman
patent: 5062565 (1991-11-01), Wood et al.

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