4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

STATS ChipPAC Ltd.

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Bonding tool for mounting semiconductor chips

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Bump-on-lead flip chip interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate

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Bump-on-lead flip chip interconnection

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Chip scale package having flip chip interconnect on die paddle

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Electrostatic discharge (ESD) protection structure

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – With inversion-preventing shield electrode
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3130915

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