Bump-on-lead flip chip interconnection

Details Bump-on-lead flip chip interconnection Bump-on-lead flip chip interconnection

2011-03-08

2011-03-08

Lee, Hsien-ming (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C438S612000, C438S613000, C257S734000, C257S778000, C257SE23021

Reexamination Certificate

active

07901983

ABSTRACT:
A flip chip interconnect is made by mating the interconnect bump directly onto a lead, rather than onto a capture pad. Also, a flip chip package includes a die having solder bumps attached to interconnect pads in an active surface, and a substrate having electrically conductive traces in a die attach surface, in which the bumps are mated directly onto the traces. In some embodiments the interconnection is formed without employing a solder mask. In some methods a curable adhesive is dispensed either onto the bumps on the die or onto the traces on the substrate; the adhesive is partly cured during the mating process, and the partly cured adhesive serves to confine the molten solder during a reflow process.

REFERENCES:
patent: 6383916 (2002-05-01), Lin
patent: 6409073 (2002-06-01), Kaskoun et al.
patent: 6458622 (2002-10-01), Keser et al.
patent: 6660560 (2003-12-01), Chaudhuri et al.
patent: 6678948 (2004-01-01), Benzler et al.
patent: 6774497 (2004-08-01), Qi et al.
patent: 6821878 (2004-11-01), Danvir et al.
patent: 7173828 (2007-02-01), Lin et al.
patent: 2001/0013423 (2001-08-01), Dalal et al.
patent: 6503687 (1994-04-01), None
patent: 09097791 (1997-04-01), None
patent: 11145176 (1999-05-01), None
patent: 11233571 (1999-08-01), None
patent: 2001156203 (2001-06-01), None
patent: 2002270732 (2002-09-01), None
patent: 2005109187 (2005-04-01), None

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