4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Vapor phase etching

Siddhartha Bhowmik

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Barrier for copper metallization

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Barrier for copper metallization

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Barrier layer for interconnect structures of a semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Formation of a slot in a silicon substrate

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Method and system for eliminating extrusions in...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2044870

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