4. Active solid-state devices (e.g., transistors, solid-state diode
  5. With means to control surface effects
  6. Insulating coating

Shwang-Ming Jeng

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C x H y sacrificial layer for cu/low-k interconnects

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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C x H y sacrificial layer for cu/low-k interconnects

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Composite etching stop in semiconductor process integration

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Composite etching stop in semiconductor process integration

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate

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Extreme low-k dielectric film scheme for advanced interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2292276

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