4. Measuring and testing
  5. With fluid pressure
  6. Leakage

Shu-Ming Chang

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3-D stackable semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Backlight module driver circuit

Electric lamp and discharge devices: systems – Plural load device systems
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Backlight module driver circuit

Electric lamp and discharge devices: systems – Plural load device systems
Reexamination Certificate

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Bonding structure with buffer layer and method of forming...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Bonding structure with buffer layer and method of forming...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Profile ID: LFUS-PAI-P-1862014

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